Request Testing
Below are the forms to initiate testing at the COE laboratory. Feel free to contact us by e-mail or phone for assistance or clarification with completing the forms. A COE employee will contact you within 24 hours of submitting a form.
Thermal Chamber Testing through ISTA Standard 20 and ASTM D3103, as well as Thermal Simulation, can be performed on packaging or other items using one of our three Environmental Test Chambers. Temperature ranges from negative 50°C up to 100°C can be programmed into the chambers as well as humidity.
Drop testing can be done in either a custom format or following one of the typical testing protocols such as the ISTA drop sequence (ISTA 3A).
R-Value or Thermal Conductivity testing can be performed on solid materials using ASTM method C518 through a Heat Flow Meter or ASTM D7984 through a Hot Disc Analyzer.
Compression Testing as well as all of the standard Corrugated Testing (ECT, FCT, etc.) can be performed up to a force of 2,000 lbs. on items with dimensions less than 13" x 13" x 20".
Infrared Imaging is done using an FLIR camera to photograph or videotape your sample (typically packaging) to show any thermal weak spots in the components. Dry ice is typically added in the case of packaging.
Thermal Chamber Testing through ISTA Standard 20 and ASTM D3103, as well as Thermal Simulation, can be performed on packaging or other items using one of our three Environmental Test Chambers. Temperature ranges from negative 50°C up to 100°C can be programmed into the chambers as well as humidity.
Drop testing can be done in either a custom format or following one of the typical testing protocols such as the ISTA drop sequence (ISTA 3A).
R-Value or Thermal Conductivity testing can be performed on solid materials using ASTM method C518 through a Heat Flow Meter or ASTM D7984 through a Hot Disc Analyzer.
Compression Testing as well as all of the standard Corrugated Testing (ECT, FCT, etc.) can be performed up to a force of 2,000 lbs. on items with dimensions less than 13" x 13" x 20".
Infrared Imaging is done using an FLIR camera to photograph or videotape your sample (typically packaging) to show any thermal weak spots in the components. Dry ice is typically added in the case of packaging.
Pack Expo Vegas - Temp
We are excited to announce that EFP’s Temperature Solutions Group will be exhibiting at Pack Expo this year along with our Custom Packaging & Components side of the business! The show will be held on September 11th – September 13th in Las Vegas, Nevada.Visit our Cold Chain booth #6729 in the Healthcare Packaging Pavilion as we showcase our new sustainable and economical initiatives to the cold chain packaging industry. At Pack Expo, you will experience exhibitors launching products, showcasing latest innovations, and problem-solving with customers from all around.
This year’s conference should be a great time and we can’t wait to connect! You can learn more about the conference here: Pack Expo Las Vegas.